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GA630TB

Our Competitive Edges of 3D AOI

• Programmable Structured Grating PMP Imaging Technology [PATENTED]

• AI Intelligent Seamless “Jigsaw” Technology[PATENTED]

• AI Automatic Programming Technology [PATENTED]

• AI Algorithm Technology [PATENTED]

• Enhanced Super RGB Pro 2D Light Source [PATENTED]

• 4/8 Projection Head Optical Source Technology [PATENTED]

• 15 Minutes AI Programming and 20~30 Minutes Fine Tuning Operation

• High-frame CXP Camera Solutions

• 3D+2D Ontology Localization Technology

• Self-developed MES Intelligent Manufacturing Access Capability

• Self-developed SPC Analysis Software & Closed-loop Control

Competitive Edges - Programmable Structured Grating PMP Imaging Technology [PATENTED]

Programmable structured grating PMP imaging technology (PSLM PMP) uses German PSLM components with international cutting-edge technology.  [Ten-year free warranty]

Unique setup of the projection head optical source inspection. 

Programmable Structured Grating PMP Imaging Technology
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Programmable Structured Grating PMP Imaging Technology

The equipment utilizes the programmable structured grating technology to intelligently switch between fine stripes and high wide-range stripes, driving phase shift errors towards zero. With no mechanical transmission components and no wear, it significantly enhances the equipment’s detection capabilities and scope of application.

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Competitive Edges - 4/8 Projection Head Optical Source Technology [PATENTED]

3D AOI uses optional 4+8 projection heads with PSLM multi-frequency projection capability to achieve the best inspection solution, covering all SMT/PTH/Semiconductor Applications. 

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Competitive Edges - AI Intelligent Seamless “Jigsaw” Technology [PATENTED]

The problems of uneven images, uneven colors, and image distortion at the joints of FOV and FOV of typical AOI. 

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AI Intelligent Seamless “Jigsaw” Technology

3D AOI uses innovative AI intelligent seamless “jigsaw” technology to achieve a level that is indistinguishable to the naked eyes. It perfectly solves the problems of unevenness, unevenness, distortion, etc. in the FOV image “jigsaw’ seams of traditional AOI. It improves the positioning accuracy of the detection frame and reduces program debugging time.

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Competitive Edges - AI Automatic Programming Technology [PATENTED]

3D AOI uses intelligent program editing methods and template-based parameter setting methods to facilitate quick programming and debugging.

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Competitive Edges – AI Algorithm Technology [PATENTED]

3D AOI uses AI algorithm to perform one of its detection capabilities to inspect IC pins height. The actual height of the pin is measured purely in 3D mode and compared with the standard threshold to confirm whether it is a fault.  

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AI Algorithm Technology

Another example of AI algorithm to perform resistor color code detection.  

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Competitive Edges - Enhanced Super RGB Pro 2D Light Source [PATENTED]

3D AOI adopts the self-developed enhanced multi-angle, multi-area, modulatable RGB+W+coaxial 2D light source design. It is suitable for the inspection of components, solder joints and text in various situations.  

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Enhanced Super RGB Pro 2D Light Source

Gem Vision 3D AOI versus Other typical 3D AOI

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Enhanced Super RGB Pro 2D Light Source
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Technology PlatformTop & Bottom Type A
SeriesGA
ModelGA630TB
Measurement Principle3D White Light PSLM PMP (Programmable Structured Grating Phase Modulation Profilometry)
MeasurementsDetection of component defects, Chip Defects, Gold Finger Defects, Insufficient Adhesive Application, and defects in the stamp after plastic sealing.
Detection of Non-Performing TypesComponent defects (Missing parts, Misalignment, Rotation, Three-dimensional polarity, Reversed parts, OCV, Warping, Sideways movement, Tombstoning, Floating, Unevenness, Poor Soldering, etc.)
FOV Size48mm x 36mm (12M 12um) Optional resolutions of 5um, 7um, 8um, 10um, and 15um, and compatible with 16MP and 21MP cameras.
Inspection MethodSimultaneous inspection of both sides, inspection of only the top side, or inspection of only the bottom side.
3D Module OptionOptional optical components include top-bottom 3D, top 3D bottom 2D, top 2D bottom 3D, and top-bottom 2D (Factory Settings).
AccuracyXY direction: 10um
RepeatabilityHeight: ≤1μm (4 Sigma)
Gage R&R<10%
Inspection Speed

0.5sec/FOV

Minimum Component008004 (Imperial) / 0201 (Metric)
Mark-point Detection Time0.3sec/piece
2D Light SourceMulti-angle, Multi-zone, Three-colour 2D light source (RGB+W)
Barcode Read1D/2D Barcode reading
Traceability SystemSupports automatic mapping generation and uploading of SECS/GEM.
Maximum Carrier Board Size430 x 500 mm
Transfer DirectionLeft to right or Right to left
Conveyor Width Adjustment Manual & Automatic
Engineering Statistics

Histogram;Xbar-R Chart;Xbar-S Chart;CP & CPK;% Gage

Repeatability Data;SPI Daily/Weekly/Monthly Reports

ProgrammingSupports both manual and automatic programming.
Operating System SupportWindows 10 Professional (64 bit)
Equipment Weight1100 Kg
Optional1D/2D Barcode scanner; Badmark function; Three-point photo capture function; Offline programming software; Repair workstation; AI-assisted judgment; DFF inspection camera